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available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b 30 db directional coupler description the XEC24P3-30G is a low profile, high performance 30db directional coupler in an easy to use, manufacturing friendly surface mount package. it is designed for ims band, rf heating applications in the 2400 mhz to 2500 mhz range. it can be used in high power applications up to 300 watts. parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of thermal expansion (cte) compatible with common substrates su ch as fr4, g-10, rf-35, ro4350 and polyimide. available in 6 of 6 enig (XEC24P3-30G) rohs compliant finish. electrical specifications ** features: ? 2400 - 2500 mhz ? high power ? very low loss ? tight coupling ? high directivity ? production friendly ? tape and reel ? enig finish frequency mean coupling insertion loss vswr directivity mhz db db max max : 1 db min 2400 ? 2500 30.0 1.0 0.1 1.15 20 frequency sensitivity power operating temp. db max avg. cw watts oc 0.25 300 -55 to +95 *power handling for commercial, non-life critical app lications. see derating char t for other applications **specification based on performance of unit properly in stalled on anaren test board 66934-0001. refer to specifications subject to change without notice. refer to parameter definitions for details. mechanical outline dimensions are in inches [millimeters] XEC24P3-30G mechanical outline tolerances are non-cumulative .250 .010 [6.35 0.25 ] .200 .010 [5.08 0.25 ] orientation mark denotes pin 1 pin 1 pin 2 pin 3 pin 4 denotes array row (rr) & column (cc) gnd pin 1 pin 2 pin 3 pin 4 .061 .006 [1.54 0.15 ] 4x .020 .004 [0.51 0.10 ] 4x .034 .004 sq [0.86 0.10 ] 4x .020 .004 [0.51 0.10 ] .120 .004 [3.05 0.10 ] .170 .004 [4.32 0.10 ] gnd cc rr
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b directional coupler pin configuration the XEC24P3-30G has an orientation marker to denote pin 1. once port one has been identified the other ports are known automatically. please see the chart below for clarification: 30db coupler pin configuration pin 1 pin 2 pin 3 pin 4 input direct isolated coupled direct input coupled isolated note: the direct port has a dc connection to the inpu t port and the coupled port has a dc connection to the isolated port. for optimum il and power handling performance, use pin 1 or pin 2 as inputs. insertion loss and power derating curves
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b insertion loss derating: the insertion loss, at a given frequency, of a group of couplers is measured at 25 ? c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 85 ? c and 150 ? c. a best-fit line for the measured data is computed and then plotted from - 55 ? c to 150 ? c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. the thermal insertion loss is defined in the power handling section of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero. if mounting temperature is greater than 95 ? c, xinger coupler will perform reliably as long as the input power is derated to the curve above typical performance (-55c, 25c, 95c & 150c): 2400-2500 mhz
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for XEC24P3-30G (feeding port 1) -55oc 25oc 95oc 150oc 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for XEC24P3-30G (feeding port 2) -55oc 25oc 95oc 150oc 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for XEC24P3-30G (feeding port 3) -55oc 25oc 95oc 150oc 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for XEC24P3-30G (feeding port 4) -55oc 25oc 95oc 150oc
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b typical performance (-55c, 25c, 95c & 150c): 2400-2500 mhz 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -33 -32 -31 -30 -29 -28 -27 frequency (mhz) coupling (db) coupling for XEC24P3-30G (feeding port 1) -55oc 25oc 95oc 150oc 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -0.2 -0.15 -0.1 -0.05 0 frequency (mhz) insertion loss (db) insertion loss for XEC24P3-30G (feeding port 1) -55oc 25oc 95oc 150oc 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -50 -40 -30 -20 -10 0 frequency (mhz) directivity (db) directivity for XEC24P3-30G (feeding port 1) -55oc 25oc 95oc 150oc 2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500 -0.2 -0.15 -0.1 -0.05 0 frequency (mhz) transmission loss (db) transmission loss for XEC24P3-30G (feeding port 1) -55oc 25oc 95oc 150oc
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 ? system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage minima of a standing wave return loss the impedance match of the coupler to a 50 ? system. return loss is an alternate means to express vswr. return loss (db)= 20log 1 - vsw r 1 vswr ? mean coupling at a given frequency ( ? n ), coupling is the input power divided by the power at the coupled port. mean coupling is the average value of the coupling values in the band. n is the number of frequencies in the band. coupling (db) = ? ? ? ? ? ? ? ? ? ) ( ) ( log 10 ) ( n cpl n in n p p c ? ? ? mean coupling (db) = n c n n n ? ? 1 ) ( ? insertion loss the input power divided by the sum of the power at the two output ports. 10log direct cpl in p p p ? transmission loss the input power divided by the power at the direct port. 10log direct in p p directivity the power at the coupled port divided by the power at the isolated port. 10log iso cpl p p frequency sensitivity the decibel difference between the maximum in band coupling value and the mean coupling, and the decibel difference between the minimum in band coupling value and the mean coupling. max coupling (db) ? mean coupling (db) and min coupling (db) ? mean coupling (db)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b notes on rf testing and circuit layout the XEC24P3-30G surface mount couplers require the use of a test fixture for verification of rf performance. this test fixture is designed to evaluate the coupler in t he same environment that is recommended for installation. enclosed inside the test fixture, is a circuit board that is fabricated using the recommended footprint. the part being tested is placed into the test fixture and pressure is applie d to the top of the device us ing a pneumatic piston. a four port vector network analyzer is connected to the fixture and is used to measure the s- parameters of the part. worst case values for each parameter are found and compared to th e specification. these worst ca se values are reported to the test equipment operator along with a pass or fail flag. see the illustrations below. 30 db test board test board in fixture test station
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b the effects of the test fixture on the measured data mu st be minimized in order to accurately determine the performance of the device under test. if the line impedance is anything other than 50 ? and/or there is a discontinuity at the microstrip to sma interface, ther e will be errors in the data for the device under test. the test environment can never be ?per fect?, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an attempt to minimize the errors associated with testing these devices. the lower the signal level that is being measured, the more im pact the fixture errors will have on the data. parameters such as return loss and isolation/directiv ity, which are specified as low as 27db and typically measure at much lower levels, will pres ent the greatest measurement challenge. the test fixture errors introduce an uncertainty to the meas ured data. fixture errors can make the performance of the device under test look better or worse than it actually is. fo r example, if a device has a known return loss of 30db and a discontinuity with a magnitude of ?35db is introduced in to the measurement path, t he new measured return loss data could read anywhere between ?26db and ?37db. this sa me discontinuity could introduce an insertion phase error of up to 1 ? . there are different techniques used throughout the industr y to minimize the affects of the test fixture on the measurement data. anaren uses the fo llowing design and de-embedding criteria: ? test boards have been designed and parameters s pecified to provide trace impedances of 50 ? 1 ? . furthermore, discontinuities at the sma to micr ostrip interface are required to be less than ?35db and insertion phase errors (due to differenc es in the connector interface discontinuities and the electrical line length) should be less than ? 0.25 ? from the median value of the four paths. ? a ?thru? circuit board is built. this is a two po rt, microstrip board that uses the same sma to microstrip interface and has the same total length (i nsertion phase) as the actual test board. the ?thru? board must meet the same stringent re quirements as the test board. the insertion loss and insertion phase of the ?thru? board are measured and stored. this data is used to completely de-embed the device under test fr om the test fixture. the de-embedded data is available in s-parameter form on the anaren website (www.anaren.com). note : the s-parameter files that are available on the ana ren.com website include data for frequencies that are outside of the specified band. it is impor tant to note that the test fixture is designed for optimum performance through 2.3ghz. some degradation in the test fixture performanc e will occur above this frequency and connector interface discontinuities of ?25db or more can be expected. this larger di scontinuity will affect the data at frequencies above 2.3ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rogers ro4350 material that is 0.030? thick. consider the case when a different material is us ed. first, the pad size must remain the same to accommodate the part. but, if the material thickness or diel ectric constant (or both) ch anges, the reactance at the interface to the coupler will also change. second, the linewidth required for 50 ? will be different and this will introduce a step in the line at the pad where the coupl er interfaces with the printed microstrip trace. both of these conditions will affect the performance of the part. to achieve the specified performance, serious attention must be given to the design and layout of the circuit environment in which this component will be used. if a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance that is present on the anaren ro4350 test board. when thi nner circuit board material is used, the ground plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if the dielectric constant of the circuit board material is higher than is used on the anaren test board. in both of these cases, narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will compensate for the extra capacitive reactance. if a thicker circ uit board or one with a lower dielectric constant is used,
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b the interface pad will have less capacitive reactance than the anaren test board. in this case, a wider section of line before the interface pad (or a larger interface pad) will in troduce a shunt capacitance and when properly tuned will match the performance of the anaren test board. notice that the board layout for the 3db is different from that of 30db couplers. the te st board for the 3db couplers has all four traces interfacing with the coupler at the sa me angle. the test board for the 30dbcouplers has two traces approaching at one angle and the other two traces at a different angle. the entry angle of the traces has a significant impact on the rf performance and these parts ha ve been optimized for the layout used on the test boards shown below. pico xinger directional 66934-0001 rev.a 4x .063 .034 typ .170 .120 (1.691) (2.050) ?.015 thru hole 30db test board testing sample parts supplied on anaren test boards if you have received a coupler installed on an anaren produced mi crostrip test board, please remember to remove the loss of the test board from the measured data. the loss is small enough that it is not of concern for return loss and isolation/directivity, but it should certainly be considered when measuring co upling and calculating the insertion loss of the coupler. an s-parameter file for a ?thru? board (see description of ?thru? boar d above) will be supplied upon request. as a first order approximation, one s hould consider the following loss estimates: frequency band avg. ins. loss of test board @ 25 ? c 410 ? 500 mhz ~ 0.04db 800 - 1000 mhz ~ 0.06db 1700 ? 2300 mhz ~0.14db 2300 ? 2700 mhz ~0.155db 3300 ? 3800 mhz ~0.20db for example, a 1900mhz, 10db coupler on a test board may measure ?10.30db from input to the coupled port at some frequency, f1. when the loss of the test board is removed, the coupling at f1 becomes -10.18db (-10.30db + 0.12db). this compensation must be made to both the c oupled and direct path measurements when calculating insertion loss. the loss estimates in the table above come from room temp erature measurements. it is important to note that the loss of the test board will change with temperature. this fact must be considered if the coupler is to be evaluated at other temperatures.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b peak power handling at sealevel high-pot testing of these couplers during the qualif ication procedure resulted in a minimum breakdown voltage of 1.44kv (minimum recorded value). this voltage le vel corresponds to a breakdown resistance capable of handling at least 12db peaks over average power levels , for very short durations. the breakdown location consistently occurred across the air interface at the coupler contact pads (see illustrati on below). the breakdown levels at these points will be affected by any contaminat ion in the gap area around these pads. these areas must be kept clean for optimum performance. at high altitudes breakdown voltage at high altitude reduces signific antly comparing with the one at sea level. as an example, plot below illustrates reduction in breakdown volt age of 1700 v at sea level with increasing altitude. the plot uses paschen?s law to predict breakdown voltage variation over the air pressure. it is recommended that the user test for voltage breakdow n under the maximum operating conditions and over worst case modulation induced power peaking. this evaluation sh ould also include extreme env ironmental conditions (such as high humidity) and physical conditions such as alignment of part to carrier board, cl eanliness of carrier board etc. test plan xinger couplers are manufactured in large panels and then separated. all parts are rf small signal tested and dc tested for shorts/opens at room temperature in the fixt ure described above . (see ?qualific ation flow chart? section for details on the accelerated life test procedures.) breakdown voltage (volts) altitude (ft)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b power handling the average power handling (total input powe r) of a xinger coupler is a function of: ? internal circuit temperature. ? unit mounting interface temperature. ? unit thermal resistance ? power dissipated within the unit. all thermal calculations are based on the following assumptions: ? the unit has reached a steady state operating condition. ? maximum mounting interface temperature is 95 o c. ? conduction heat transfer through the mounting interface. ? no convection heat transfer. ? no radiation heat transfer. ? the material properties are constant over the operating temperature range. finite element simulations are made for each unit. t he simulation results are used to calculate the unit thermal resistance. the finite element simulation requires the following inputs: ? unit material stack-up. ? material properties. ? circuit geometry. ? mounting interface temperature. ? thermal load (dissipated power). the classical definition for dissip ated power is temperature delta ( ? t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total input power (p in ) and the thermal insertion loss (il therm ): ) ( 10 1 10 w p r t p therm il in dis ? ? ? ? ? ? ? ? ? ? ? ? ? ? (1) power flow and nomenclature for an ?h? style coupler is shown in figure 1.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b pin 1 pin 4 input port coupled port isolated port direct port p in p out (rl) p out (dc) p out (cpl) p out (iso) figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ideal, and that there are no radiation losses, power will exit the coupler at all four port s. symbolically written, p out(rl) is the power that is returned to the source because of impedance mismatch, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and direct ports: note: in this document, insertion loss is taken to be a positi ve number. in many places, insertion loss is written as a negative number. obviously, a mere sign change equates the two quantities. ) db ( p p p log 10 il ) dc ( out ) cpl ( out in 10 ? ? ? ? ? ? ? ? ? ? ? (2) in terms of s-parameters, il can be computed as follows: ) ( log 10 2 41 2 21 10 db s s il ? ? ? ? ? ? ? ? ? ? (3) we notice that this insertion loss value includes the power lost because of return loss as well as power lost to the isolated port. for thermal calculations, we are only interested in the power lost ?inside? the coupler. since p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not be included in the insertion loss for thermal calculations. therefore, we define a new inserti on loss value solely to be used for thermal calculations:
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b ) ( log 10 ) ( ) ( ) ( ) ( 10 db p p p p p il rl out iso out dc out cpl out in therm ? ? ? ? ? ? ? ? ? ? ? ? ? (4) in terms of s-parameters, il therm can be computed as follows: ) ( log 10 2 41 2 31 2 21 2 11 10 db s s s s il therm ? ? ? ? ? ? ? ? ? ? ? ? (5) the thermal resistance and power dissipated within the unit are then used to calculate the average total input power of the unit. the average total steady state input power (p in ) therefore is: ) ( 10 1 10 1 10 10 w r t p p therm therm il il dis in ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? (6) where the temperature delta is the circuit temperature (t circ ) minus the mounting interface temperature (t mnt ): ) ( c t t t o mnt circ ? ? ? (7) the maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit. multiple material combinations and bonding techniques ar e used within the xinger product family to optimize rf performance. consequently the maximum allowable circui t temperature varies. please note that the circuit temperature is not a function of the xinger case (top surf ace) temperature. therefore, the case temperature cannot be used as a boundary condition for power handling calculations. due to the numerous board materials and mounting configuratio ns used in specific customer configurations, it is the end users responsibility to ensure that the xinger coupler mounting interface temperature is maintained within the limits defined on the power derating plots for the required average power handling. additionally appropriate solder composition is required to prevent reflow or fatigue failure at the rf ports. finally, reliability is improved when the mounting interface and rf port temperatures are kept to a minimum. the power-derating curve illustra tes how change s in the mounting interface temper ature result in converse changes of the power handling of the coupler. .
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b mounting in order for xinger surface mount couplers to work optimally, there must be 50 ? transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensure proper electrical performance. if either of these two condi tions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hybrid and directional couplers are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17-25 ppm/ o c. when a surface mount coupler is mounted to a printed circuit board, the primary concerns are; ensuring the rf pads of the device are in contact with the circuit trace of the pcb and insuring the ground plane of neither the component nor the pcb is in contact with the rf signal. mounting footprint .170 [4.32] .120 [3.05] .034 [0.86] 4x 50 ? transmission line multiple plated thru holes to ground to ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath the part orientated as shown with text facing up dimensions are in inches [millimeters] XEC24P3-30G mounting footprint coupler mounting process the process for assembling this component is a conventional surface mount pr ocess as shown in figure 1. this process is cond ucive to both low and high volume usage. figure 1: surface mounting process steps storage of components: the xinger couplers are available in enig finish. dry packaging will be effective for a least one year if stored at less than 40 c and 90% rh (see ipc/jedec j-std-033). for more than one year, shelf life and storage are similar to parts with tin lead finish. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this coefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as rf35, ro4003, fr4, polyimide and g-10 materials. mounting to ?hard? substrates (alumina etc.) is possible depending upon operational temperature requirements. the solder surfaces of the coupler are all copper plated with either an immersion tin or tin-lead exterior finish. solder paste: all conventional solder paste formulations will work well with anaren?s xinger surface mount components. solder paste can be applied with stencils or syringe dispensers. an exam ple of a stenciled solder paste deposit is shown in figure 2. as shown in the figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.069 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of today?s conventional reflow methods. low and high temperature thermal reflow profiles are shown in figures 5 and 6, respectively. manual soldering of these components can be done with conventional surface mount non-contact hot air soldering tools. board pre-heating is highly recommended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided. solder joint composition the percentage by mass of gold in xinger couplers with enig plating is low enough that it does not pose a gold embrittlement risk. table below illustrates the c onfigurations evaluated assuming the enig plating thickness is min 7in, thickness of solder is 2000in and thickness of tin lead plating is 200in xinger finish pcb pad finish solder composition % gold,wt 1 enig tin-lead eutectic tin-lead <3% 2 enig enig eutectic tin-lead <3% 3 enig tin-lead tin-silver <3% 4 enig enig tin-silver <3%
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b figure 5 ? low temperature eutectic solder ( 63/37) reflow thermal profile figure 6 ? high temperature snag or sac solder reflow thermal profile
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b qualification flow chart xinger product qualification visual inspection n=55 mechanical inspection n=50 solderability test n= 5 initial rf test n=50 visual inspection n=50 automated handler testing n=45 visual inspection n=50 post automated handler test rf test n=50 visual inspection n=50 solder units to test board n=25 post solder visual inspection n=25 visual inspection n=25 rf test at -55c, 25c, 95c n=20 initial rf test board mounted n=25 visual inspection n=25 post resistance heat rf test n=20 mechanical inspection n=20 voltage breakdown test mil 202f, method 301 25c 5kv n= 40 visual inspection n=50 control units rf test 25c only n=5 loose control un its n=5 resistance to solder mil 202g method 210f, condition k heat n=20 loose control units n=5 control units n=5 loose control units n=5
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model XEC24P3-30G rev b contr ol u nits n = 10 post voltage rf test n=50 therm al cycle100 cycles -55 to 125c. dwell time= 30 min n=40 visual inspection n=50 control units n=10 visual inspection n=50 bake units for 1 hour at 100 to 120c n=40 125% power life test 72 hrs n= 3 post bake rf test n=50 visual inspection n=30 microsection 3 test units 1 control final rf test @ 25c n=2 5 microsection 2 life, 1 high power and 1 control p ost mois ture resi stanc e rf test n=50 post thermal rf test n=50 m o is ture resi stanc e testi ng -25 to 65 c fo r 2 hrs @ 90% humidity. soak for 168 hrs at 90% to 85% humidity. ramp temp to 25c in 2 hrs @ 90% humidity. then soak @ -10c for 3 hrs. n=40 p ost mois ture resi stanc e rf test n=50 control units n = 10
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model XEC24P3-30G rev b packaging and ordering information parts are available in a reel and as loose parts in a bag. packaging follows eia 481-d for r eels. parts are oriented in tape and reel as shown below. section a-a .157 [4.00] .012 [.30] .079 [2.00] .079 [2.00] .264 [6.70] .217 [5.50] typ ?.059 [?1.50] .069 [1.75] .217 [5.50] .472 [12.00] .315 [8.00] dimensions are in inches [millimeters] direction of part feed (unloading) rr cc model -30g XEC24P3-30Gr & XEC24P3-30Gr1 table 1: reel dimensions (mm) XEC24P3-30Gr ?a b ?c ?d quantity/reel 2000 330.0 12.0 102.03 13.00 XEC24P3-30Gr1 177.80 12.0 50.80 13.00 250 ?d b ?a ?c

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